Overo® FE COM

Product Overview

The power and function of an Overo® Fire COM built with components rated for extended temperatures, (ETC). Running at 600Mhz, the Overo® FE COM is ideal for smart, small, and low-temperature applications for location tracking, transportation, military, industrial and robotics.

Temperature

Built with components rated -40C < T < 85C except for: 
  • microSD card slot: -25C < T < 85C 
  • Bluetooth/Wifi module: -20C < T < 75C 

Overo® FE COM

Texas Instruments OMAP 3530 Applications Processor

Processor Speed

600 MHz

Digital signal processor (DSP)

C64x+ digital signal processor (DSP) core

OpenGL

POWERVR SGX for 2D and 3D graphics acceleration

RAM

512 MB

NAND

512 MB

Performance

Up to 1200 Dhrystone MIPS

Bluetooth

Included 

802.11 b/g

Included

Camera Connector

1 x 27-pin Hirose camera connector (J5)

microSD card slot

Included

Power Management

Texas Instruments TPS65950

Connectors

2 x 70-pin AVX connectors (J1 & J4)

Layout

For OEM design, use layout version R2606 or later, shown here.

Mounting Holes

Four (4) x #0 mounting holes for securing to Overo-series, or custom, expansion board

Power

Powered via expansion board (Overo series or custom) connected to dual 70-pin connectors

Weight

GS3503FE @ 5.6g 
GUM3503FE @ 42.6g (incl. shipping case & 2 x antenna)

Length

58 mm

Width

17 mm

Height

4.2 mm